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~person:"Wang, Zhile"
~person:"Wang, Zhi-Wei"
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China
5
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4
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4
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2
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2
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2
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2
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1979-2012
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24.04.1995
1
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Wang, Zhile
Wang, Zhi-Wei
Wang, Zhi
322
Wei, Shang-Jin
54
Wei, Shang-jin
41
Zhu, Kunfu
23
Robinson, Sherman
22
Koopman, Robert
20
Tang, Heiwai
19
Wang, Fei
16
Wang, Zhiwei David
16
Koopman, Robert Bernard
15
Liu, Xuepeng
14
Noland, Marcus
13
Wang, Zhi Jay
13
Yu, Xinding
13
Zhai, Fan
12
Zhang, Qinghua
10
Mattoo, Aaditya
9
Meng, Bo
9
Powers, William
9
Wong, Anna
9
Patel, Nikhil
8
Wang, Zhi‐Wei
8
Xu, Dianqing
8
Ferrantino, Michael J.
7
Wang, Yan
7
Canning, Patrick
6
Dean, Judith Myrle
6
Fung, Kwok-chiu
6
Gehlhar, Mark
6
Lawrence, John D.
6
Wang, Jiaxin
6
Yao, Shunli
6
Chan, Kam C.
5
Ferrantino, Michael Joseph
5
Hu, Chang‐Ying
5
Lewis, Jeffrey D.
5
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5
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5
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1
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1
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Packaging technology & science : an international journal
11
Journal of the Operations Research Society of Japan : JORSJ
2
21st century Asia : economic restructuring and challenges of mega-cities
1
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1
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1
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1
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1
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OLC EcoSci
14
ECONIS (ZBW)
6
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1
Does reliable information matter? : towards a trustworthy co-created recommendation model by mining unboxing reviews
Li, Sheng Tun
;
Pham, Thuong Thi
;
Chuang, Hui Chi
;
Wang, …
- In:
Information systems and e-business management : ISeB
14
(
2016
)
1
,
pp. 71-99
Persistent link: https://www.econbiz.de/10011672240
Saved in:
2
South Korean multinational companies in China
Wang, Zhile
- In:
China, world economy and Korea - China economic cooperation
,
(pp. 276-333)
.
2012
Persistent link: https://www.econbiz.de/10009731645
Saved in:
3
Evaluation of product dropping damage based on key component Presented at the 15th IAPRI World Conference on Packaging, Tokyo, Japan, 2006
Wang, Zhi-Wei
;
Jiang, Jiu-Hong
- In:
Packaging technology & science : an international journal
23
(
2010
)
4
,
pp. 227-239
Persistent link: https://www.econbiz.de/10008427173
Saved in:
4
Plateau stress of paper honeycomb as response to various relative humidities
E, Yu-Ping
;
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
23
(
2010
)
4
,
pp. 203-217
Persistent link: https://www.econbiz.de/10008427175
Saved in:
5
Energy absorption diagrams of paper honeycomb sandwich structures
Wang, Dong-Mei
;
Wang, Zhi-Wei
;
Liao, Qiang-Hua
- In:
Packaging technology & science : an international journal
22
(
2009
)
2
,
pp. 63-68
Persistent link: https://www.econbiz.de/10008211486
Saved in:
6
A systematic study on the stability of UV ink photoinitiators in food simulants using GC
Wang, Zhi-Wei
;
Huang, Xiu-Ling
;
Hu, Chang-Ying
- In:
Packaging technology & science : an international journal
22
(
2009
)
3
,
pp. 151-160
Persistent link: https://www.econbiz.de/10008241529
Saved in:
7
Chemical migration and food contact materials, edited by Karen Barnes, Richard Sinclair and David Watson. Woodhead Publishing Limited, Published in North America by CRC Press LLC:...
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
21
(
2008
)
2
,
pp. 115-118
Persistent link: https://www.econbiz.de/10007978753
Saved in:
8
Experimental investigation into the cushioning properties of honeycomb paperboard
Wang, Dong-Mei
;
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
21
(
2008
)
6
,
pp. 309-316
Persistent link: https://www.econbiz.de/10008105792
Saved in:
9
Critical buckling load of paper honeycomb under out-of-plane pressure
Lu, Li-Xin
;
Sun, Ya-Ping
;
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
18
(
2005
)
3
,
pp. 141-150
Persistent link: https://www.econbiz.de/10007023897
Saved in:
10
Study on rhomb shoulders in packaging machines
Zhou, Yi-Jie
;
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
17
(
2004
)
5
,
pp. 287
Persistent link: https://www.econbiz.de/10007026305
Saved in:
11
Dropping damage boundary curves for cubic and tangent package cushioning systems
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
15
(
2002
)
5
,
pp. 263-266
Persistent link: https://www.econbiz.de/10007034797
Saved in:
12
On evaluation of product dropping damage
Wang, Zhi-Wei
- In:
Packaging technology & science : an international journal
15
(
2002
)
3
,
pp. 115-120
Persistent link: https://www.econbiz.de/10007034883
Saved in:
13
Foreign direct investment in China
Wang, Zhile
- In:
21st century Asia : economic restructuring and …
,
(pp. 31-37)
.
2001
Persistent link: https://www.econbiz.de/10001667286
Saved in:
14
Shock Spectra and Damage Boundary Curves for Non-linear Package Cushioning Systems
Wang, Zhi-Wei
;
Hu, Chang-Ying
- In:
Packaging technology & science : an international journal
12
(
1999
)
5
,
pp. 207-218
Persistent link: https://www.econbiz.de/10007052890
Saved in:
15
NEC investment in China
Wang, Zhile
- In:
China newsletter
6
(
1998
)
137
,
pp. 20-24
Persistent link: https://www.econbiz.de/10001255137
Saved in:
16
Deutsche Direktinvestitionen in der Volksrepublik China : vielfältige Perspektiven erfolgreicher Zusammenarbeit
Wang, Zhile
-
1996
Persistent link: https://www.econbiz.de/10014272956
Saved in:
17
An Algorithm for a Multiobjective. Multilevel Linear Programming
Wang, Zhi-Wei
;
Nagasawa, Hiroyuki
;
Nishiyama, Noriyuki
- In:
Journal of the Operations Research Society of Japan : JORSJ
39
(
1996
)
2
,
pp. 76-134
Persistent link: https://www.econbiz.de/10006739987
Saved in:
18
Deutsche Direktinvestitionen in China : Bericht über das Symposium am 24. und 25. April 1995 in Peking
Foerster, Andreas
(
contributor
);
Wang, Zhile
(
contributor
)
-
1995
Persistent link: https://www.econbiz.de/10000552063
Saved in:
19
A New Method for Solving a Linear Two-level Decentralized Problem
Wang, Zhi-Wei
;
Nagasawa, Hiroyuki
;
Nishiyama, Noriyuki
- In:
Journal of the Operations Research Society of Japan : JORSJ
38
(
1995
)
3
,
pp. 354
Persistent link: https://www.econbiz.de/10006740671
Saved in:
20
A method for generating nondominated solutions to a multiobjective-headquarters, three-level decentralized system
Wang, Zhi-Wei
;
Nagasawa, Hiroyuki
;
Nishiyama, Noriyuki
- In:
Computers & industrial engineering : CAIE ; an …
27
(
1994
)
1-4
,
pp. 405-408
Persistent link: https://www.econbiz.de/10005999884
Saved in:
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