Comparison of Hot-carriers Effects in SOI and Bulk Devices Using a Photon Emission Technique
Year of publication: |
1996
|
---|---|
Authors: | Guichard, E. ; Leroux, C. ; Blachier, D. ; Reimbold, G. ; Cristoloveanu, S. ; Borel, G. |
Published in: |
Quality and reliability engineering international. - Chichester [u.a.] : Wiley, ISSN 0748-8017, ZDB-ID 506412. - Vol. 12.1996, 4, p. 291-296
|
Saved in:
Saved in favorites
Similar items by person
-
Electromigration of Interconnects of a TiN-Cu-TiN-Ti Structure
Braud, F., (1996)
-
Electromigration in AlCu Interconnections with W-plug Contacts
Ferlazzo, L., (1993)
- More ...