Computer Chips: Stronger Ties Can Mitigate Costs
| Year of publication: |
2023
|
|---|---|
| Authors: | Freund, Caroline L. ; McDaniel, Christine |
| Published in: |
Intereconomics. - ISSN 1613-964X. - Vol. 58.2023, 5, p. 283-284
|
| Publisher: |
Warsaw : Sciendo |
| Subject: | Technologiepolitik | Halbleiter | China | USA | technology policy | semiconductor |
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Article |
| Language: | English |
| Other identifiers: | 10.2478/ie-2023-0057 [DOI] 1868795349 [GVK] hdl:10419/281390 [Handle] RePEc:vrs:intere:v:58:y:2023:i:5:p:283-284:n:5 [RePEc] |
| Classification: | F13 - Commercial Policy; Protection; Promotion; Trade Negotiations ; F15 - Economic Integration ; F51 - International Conflicts; Negotiations; Sanctions |
| Source: |
Persistent link: https://www.econbiz.de/10014459426