Effect of Dry Ice Jet Velocity on Cooling Characteristics of Electronic Chip Based on Optimized H/D

The heat dissipation problem of chips with high heat flux turns out to be increasingly severe. The inability of the chips to effectively cool down has significantly limited their working performance, and the issue of efficient heat dissipation should be managed urgently. In this study, an electronic chip cooling system using dry ice as the cooling fluid in the radiator was developed. The Joule-Thomson effect was adopted to generate dry ice, and the high heat transfer coefficient of jet impact heat transfer was integrated with the high sublimation latent heat of dry ice. Subsequently, the effects of the ratio of the height of the radiator to the inlet diameter ( H/D ) and the jet speed of dry ice on the heat transfer characteristics of the radiator were determined by the theoretical calculations and the experimental tests. When H/D = 2 and the injection velocity was 35.67m·s -1 , the Re was 241,314, and the heat transfer coefficient of the radiator was determined as 10,724.36W·m -1 ·K -1 . The chip temperature could be effectively regulated by controlling the flow rate of dry ice. As demonstrated by the comparative analysis, the cooling effect of the dry ice jet cooling electronic chip system was more significant than that of the water-cooling system and some nanofluid cooling systems. The system could effectively exploit the natural working medium of carbon dioxide and efficiently cool electronic chips. The research results achieved lay a foundation for dry ice cooling of high heat flux density chips and are of great importance to resource conservation and environmental protection