Formation of structural holes in R&D context : the effect of inventors' knowledge abilities and patenting output
Year of publication: |
2025
|
---|---|
Authors: | Wang, Yalan ; Wang, Chengjun ; Wang, Wei ; Sun, Xiaoming |
Subject: | Broker | Key inventor | Knowledge abilities | Knowledge management | Patenting output | Structural holes | Wissensmanagement | Patent | Wissenstransfer | Knowledge transfer | Erfindung | Invention | Wissen | Knowledge |
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