Identification and rating of workforce competencies for manufacturing process engineers : case study of an IC packaging process engineer
Ling-Jing Kao, Chih-Chou Chiu, Cheng-Chin Lu, and Chung-Yi Wu
| Year of publication: |
2023
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|---|---|
| Authors: | Kao, Ling-Jing ; Chiu, Chih-Chou ; Lu, Cheng-Chin ; Wu, Chung-Yi |
| Published in: |
IEEE transactions on engineering management : EM. - New York, NY : IEEE, ISSN 0018-9391, ZDB-ID 160438-7. - Vol. 70.2023, 1, p. 196-208
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| Subject: | IC packaging process engineer | operational competencies | problem-solving competencies | workforce competency identification | Prozessmanagement | Business process management | Qualifikation | Occupational qualification | Industrie | Manufacturing industries | Kompetenz | Competence |
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Other identifiers: | 10.1109/TEM.2021.3050343 [DOI] |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://ebvufind01.dmz1.zbw.eu/10014231446