On an IC wire bonding machine production-inventory problem with time value of money
Dah-Chuan Gong, Jia-Lun Kang, Gary C. Lin and T.C. Hou
| Year of publication: |
1-15 May 2017
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| Authors: | Gong, Dah-Chuan ; Kang, Jia-Lun ; Lin, Gary C. ; Hou, T. C. |
| Published in: |
International journal of production research. - London : Taylor & Francis, ISSN 0020-7543, ZDB-ID 160477-6. - Vol. 55.2017, 9/10 (1/15.5.), p. 2431-2453
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| Subject: | imperfect production system | production time | time value | IC packaging industry | wire bonding machine | Produktionssystem | Manufacturing system | Theorie | Theory | Durchlaufzeit | Lead time | Anleihe | Bond | Verpackungswirtschaft | Packaging industry |
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Other identifiers: | 10.1080/00207543.2016.1213914 [DOI] |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10011648908