Quality improvement for wire bond strength within the semiconductro manufacturing environment
Year of publication: |
2012
|
---|---|
Authors: | Kok, C. K. ; Yeo, V. S. H. ; Sim, H. K. |
Published in: |
International journal of six sigma and competitive advantage : IJSSCA. - Olney, Bucks : Inderscience Enterprises, ISSN 1479-2494, ZDB-ID 2164922-4. - Vol. 7.2012, 2/4, p. 151-167
|
Subject: | Six Sigma | define-measure-analyse-improve-control | DMAIC | quality improvement | wire bonding | bond strength | Qualitätsmanagement | Quality management | Anleihe | Bond | Öffentliche Anleihe | Public bond |
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