TEMPERATURE DEPENDENCE OF ELECTROLESS Ni–P DEPOSITION ON POLYESTER FABRIC

The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni–P deposits were studied. The results showed that the deposition rate of the Ni–P deposit and P content of the Ni–P layer increased with the rise of temperature of the plating bath. Scanning electron microscopy of the Ni–P deposits showed a nodule structure. The Ni–P plating layers had an amorphous structure and surface resistance of the layer decreased with the rise of temperature. In addition, the electromagnetic interference shielding effectiveness (EMI SE) of electroless Ni–P plated polyester fabric was also investigated. The result indicated that EMI SE of Ni–P plated polyester fabric was close to 45–50 dB when the surface resistance was 0.63 Ω/□.