Search Results - person:"Guo, Jian-Xin"

Low-carbon technology development under multiple adoption risks

Guo, Jian-Xin; Zhu, Kaiwei; Tan, Xianchun; Gu, Baihe - In: Technological forecasting & social change : an … 172 (2021), pp. 1-15

Persistent link: https://www.econbiz.de/10013175498

Implications for enterprise to adopt cleaner technology : from the perspective of energy market and commodity market

Guo, Jian-Xin; Zhu, Kaiwei - In: Research in international business and finance 57 (2021), pp. 1-10

Persistent link: https://www.econbiz.de/10013332953

Emission path planning based on dynamic abatement cost curve

Guo, Jian-Xin; Zhu, Lei; Fan, Ying - In: European journal of operational research : EJOR 255 (2016) 3, pp. 996-1013

Persistent link: https://www.econbiz.de/10011556548

INVESTIGATION OF LEAKAGE CURRENT BEHAVIOR OF Pt/Bi0.975La0.025Fe0.975Ni0.025O3/Pt CAPACITOR MEASURED AT DIFFERENT TEMPERATURES

DAI, XIU HONG; ZHAO, HONG DONG; ZHANG, LEI; ZHU, HUI JUAN; … - In: Surface Review and Letters (SRL) 21 (2014) 02, pp. 1450029-1

Polycrystalline Bi0.975La0.025Fe0.975Ni0.025O3 (BLFNO) film is fabricated on Pt/Ti/SiO2/Si(111) substrate by sol–gel method. It is found that the well-crystallized BLFNO film is polycrystalline, and the Pt/BLFNO/Pt capacitor possesses good ferroelectric properties with remnant polarization of...

Persistent link: https://www.econbiz.de/10011011157

INVESTIGATION OF Ta/Ni–Al INTEGRATED FILM USED AS A DIFFUSION BARRIER LAYER BETWEEN Cu AND Si

YANG, LIM; WANG, SHI JIE; HUO, JI CHUAN; LI, XIAO HONG; … - In: Surface Review and Letters (SRL) 21 (2014) 06, pp. 1450079-1

Ta (3.3 nm)/Ni–Al (3.3 nm) integrated films deposited on Si substrates by magnetron sputtering, annealed at various temperatures in a ultra-high vacuum, have been studied as diffusion barrier layers between Cu and Si for application in Cu interconnection. The images of transmission electron...

Persistent link: https://www.econbiz.de/10011106360