In semiconductor wafer dicing, one particular area of interest is the process of visual inspection to detect manufacturing defects that occur throughout the manufacturing process. Emerging defect patterns are typically in the micrometer range, translating to barely visible defects in pixel size...

Improving the accuracy of sheet metal localization in industrial machines is of great interest to many automated manufacturing systems. Current vision-based systems typically rely on traditional image processing algorithms to locate the position of sheets in images. However, these algorithms...

Despite the prevalence of photographs in corporate sustainability reporting, their use is not yet sufficiently understood. To the best of our knowledge, this paper is the first large‐scale study in the field. Introducing a novel machine‐supported approach, we assess environmental photograph...

We propose a novel image-analysis based machine-learning approach to the fully-automated identification of the optical quality, of functional properties, and of manufacturing parameters in the field of 2D inkjet-printed test structures of conductive traces. To this end, a customizable modular...

Visually impaired individuals encounter numerous impediments when traveling, such as navigating unfamiliar routes, accessing information, and transportation, which can limit their mobility and restrict their access to opportunities. However, assistive technologies and infrastructure solutions...