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Numerical simulation approach on stress and strain for chip scale package under thermal cycling
Yang, Ping; Li, Wei - In: International journal of manufacturing technology and … 18 (2009) 3, pp. 300-307
Persistent link: https://www.econbiz.de/10003895444
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Special issue: Design method and manufacturing technology for products
Yang, Ping (contributor) - 2009
Persistent link: https://www.econbiz.de/10010375606
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Modelling approach of a cymene-Si-Oil damping shock absorber based on neural network algorithm
Yang, Ping; Jiqing, Tan; Ningbo, Liao; Jianbo, Yang - In: International journal of product development : IJPD 6 (2008) 1, pp. 81-93
Persistent link: https://www.econbiz.de/10003772112
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Intelligent prediction of annual CO2 emissions under data decomposition mode
Wang, Yelin; Yang, Ping; Song, Zan; Chevallier, Julien; … - In: Computational economics 63 (2024) 2, pp. 711-740
Persistent link: https://www.econbiz.de/10014472551