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Testing of the Quality of Solder Joints through the Analysis of their Thermal Behaviour with an Interferometric Laser Probe
Claeys, W.; Quintard, V.; Dilhaire, S.; Lewis, D.; Danto, Y. - In: Quality and reliability engineering international 10 (1994) 3, pp. 237-242
Persistent link: https://www.econbiz.de/10006408735
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Thermoreflectance Optical Test Probe for the Measurement of Current-induced Temperature Changes in Microelectronic Components
Claeys, W.; Dilhaire, S.; Quintard, V.; Dom, J.P.; Danto, Y. - In: Quality and reliability engineering international 9 (1993) 4, pp. 303-308
Persistent link: https://www.econbiz.de/10006413427
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Laser Probe Measurements of Quality Evolution of Solder Joints during Thermal Cycling Ageing Tests
Quintard, V.; Parmentier, B.; Phan, T.; Lewis, D.; … - In: Quality and reliability engineering international 12 (1996) 6, pp. 447-452
Persistent link: https://www.econbiz.de/10006402325
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Optical Ammeter for Integrated Circuit Characterization and Failure Analysis
Claeys, W.; Dilhaire, S.; Lewis, D.; Quintard, V.; Phan, T. - In: Quality and reliability engineering international 11 (1995) 4, pp. 247-252
Persistent link: https://www.econbiz.de/10006404884
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Component Reliability and Testing - Strain Energy Imaging of a Power MOS Transistor Using Speckle Interferometry
Dilhaire, S.; Grauby, S.; Jorez, S.; Claeys, W. - In: IEEE transactions on reliability : R ; IEEE T R 53 (2004) 2, pp. 293
Persistent link: https://www.econbiz.de/10006609584
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Integration of the securities clearing systems
Claeys, W. - In: Further perspectives in financial integration in Europe …, (pp. 129-142). 1994
Persistent link: https://www.econbiz.de/10001286059
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Long-term Reliability Prediction of 935 nm LEDs Using Failure Laws and Low Acceleration Factor Ageing Tests
Deshayes, Y.; Bechou, L.; Verdier, F.; Danto, Y. - In: Quality and reliability engineering international 21 (2005) 6, pp. 571-594
Persistent link: https://www.econbiz.de/10006361602
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Comparison Between the Piezoelectric Method and Ultrasonic Signal Analysis for Crack Selection in Type II Multilayer Ceramic Capacitors
Ousten, Y.; Mejdi, S.; Bechou, L.; Tregon, B.; Danto, Y. - In: Quality and reliability engineering international 14 (1998) 2, pp. 91-94
Persistent link: https://www.econbiz.de/10006393181
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Non-destructive Detection and Localization of Defects in Multilayer Ceramic Chip Capacitors using Electromechanical Resonances
Bechou, L.; Mejdi, S.; Ousten, Y.; Danto, Y. - In: Quality and reliability engineering international 12 (1996) 1, pp. 43-54
Persistent link: https://www.econbiz.de/10006401896
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Comparison of Conventional and Pseudomorphic HEMTs Performances by Drain Current Transient Spectroscopy and L. F. Channel Noise
Saysset, N.; Labat, N.; Touboul, A.; Danto, Y.; Dumas, J.M. - In: Quality and reliability engineering international 12 (1996) 4, pp. 309-316
Persistent link: https://www.econbiz.de/10006403119