3d Printable Cyclosiloxane-Containing High-Temperature Resistan T Resin

Digital light processing (DLP) 3D printing technology has the advantages of rapid preparation of high-precision complex devices. The insufficient high-temperature resistance and mechanical properties of the existing photosensitive resin seriously curtailing the potential applications. Herein, a photosensitive resin based on cyclosiloxane that has a rapid curing time of under 1s has been designed and synthesized. The UV curable resin based on thiol-ene process showed high-temperature resistance (5% weight loss ≈390 ℃), and exhibited one of the highest reported tensile strengths (≈4 MPa) for printed silicone-based structures. Photo-rheology was combined with Beer-Lambert's law to gain precise control of the printing parameters and improve the lateral resolution during the polymerization processes. This study also verified the feasibility of ceramic conversion of the printed parts and preparation of composite ink materials (MXene, Invisible ink) for functional devices fabricatrion. This work provides a design guidance for 3D printable silicone resins for intricate structures preparation through a more facile and sustainable way, this is of particularly importance when the field of 3D printing is rapidly becoming more commonplace for both academic research and industries applications