Application of RFID on equipment parts readiness management system of semiconductor packaging plant
Wei-Ling Wang, Chiao-Tzu Huang, Shu-Jen Wang and Chia-Pao Chang; Hui-Wen Liao
| Year of publication: |
2013
|
|---|---|
| Authors: | Wang, Wei-Ling ; Huang, Chiao-Tzu ; Wang, Shu-Jen ; Chang, Chia-Pao ; Liao, Hui-Wen |
| Published in: |
International journal of information technology and management : IJITM. - Genève : Inderscience Enterprises, ISSN 1461-4111, ZDB-ID 2262721-2. - Vol. 12.2013, 1/2, p. 67-84
|
| Subject: | RFID | Halbleiter | Semiconductor | Halbleiterindustrie | Semiconductor industry |
| Extent: | Ill., graph. Darst. |
|---|---|
| Type of publication: | Article |
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10009703840