Automated bonding position inspection on multi-layered wire IC using machine vision
Year of publication: |
2010
|
---|---|
Authors: | Perng, Der-baau ; Lee, Shu-ming ; Chou, Cheng-chuan |
Published in: |
International journal of production research. - London : Taylor & Francis, ISSN 0020-7543, ZDB-ID 160477-6. - Vol. 48.2010, 23/24 (1/15.12.), p. 6977-7001
|
Subject: | Halbleiterindustrie | Semiconductor industry | Produktionstechnik | Manufacturing technology | Draht | Wire | Theorie | Theory |
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