Bridging and bonding : exploring the influence of community-level networks on product innovation in video game communities
Jialing Liu, Jiang Wei, and Tengjian Zou
| Year of publication: |
2024
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| Authors: | Liu, Jialing ; Wei, Jiang ; Zou, Tengjian |
| Published in: |
IEEE transactions on engineering management : EM ; a publication of the IEEE Engineering Management Society. - New York, NY : IEEE, ISSN 1558-0040, ZDB-ID 2021741-9. - Vol. 71.2024, p. 6044-6062
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| Subject: | Online community | product innovation | social networks | structural hole theory | Soziales Netzwerk | Social network | Social Web | Social web | Innovation | Produktentwicklung | New product development | Computerspiel | Video game | Wissenstransfer | Knowledge transfer | Unternehmensnetzwerk | Business network |
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Other identifiers: | 10.1109/TEM.2024.3375312 [DOI] |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10015412447