Effects of Solution Temperatures on the Microstructure and Properties of a Copper Alloy by Semisolid Back Extrusion

In this work, a semisolid back-extruded ZCuSn10P1 copper alloy sleeve was solution treated. The effects of solution temperature on the microstructures and mechanical properties were investigated. The results show that the solution and aging treatments have a great influence on the microstructures, mechanical properties, corrosion properties, and hardness of the semisolid back-extruded sleeve. When the solution temperature increases from 600 ℃ to 750 ℃, the tensile strength, Brinell hardness, and average grain size of the solid phase first increase and then decrease. In addition, the elongation increases, and the content of the intergranular eutectoid phase first decreases and then increases. Through solution and aging treatment, the content of Sn in the solid phase is increased, the segregation of elements is effectively improved, and the corrosion resistance of the material is enhanced. The solution and aging process with a better comprehensive performance had the following conditions: 700 ℃ for 1 h and then 350 ℃ for 1 h. Here, the corrosion resistance is the best, the tensile strength reaches the maximum of 422 MPa, the elongation is 10.7%, and the Brinell hardness reaches the maximum value of 152 HBW. The values of these properties were increased by 3.7%, 24.7%, and 10.9%, respectively, compared with the previous solution and aging treatment