Electrical conduction in nanostructured carbon and carbon-metal films grown by supersonic cluster beam deposition
We have studied the electrical conduction in nanostructured carbon (ns-C) films produced by deposition of a supersonic beam of neutral carbon clusters. The d.c. conduction properties of these films have been measured in situ during the deposition process and ex situ as a function of the temperature in vacuum and in ambient of different gases (H<Subscript>2</Subscript>, N<Subscript>2</Subscript>, CH<Subscript>4</Subscript>, He). The ns-C films exhibit an ohmic behavior with a room temperature resistivity in the range of 10<Superscript>7</Superscript>-10<Superscript>9</Superscript> <InlineEquation ID="Equ1"> <EquationSource Format="TEX">${\rm\Omega}$</EquationSource> </InlineEquation>cm depending on the growth and storage conditions. Conductivity vs. temperature measured in vacuum in the range 290-400 K is characterized by activation energies in the range of 0.3-1.7 eV, the current response does not differ significantly in gas atmosphere. Nanocomposite carbon-metal films have been obtained by adding small amounts of metallorganic precursors containing molybdenum and cobalt during the formation of carbon clusters prior to deposition. The films are characterized by porous carbon networks containing small metal and metal carbide clusters. Electrical transport properties of these films have been studied as a function of temperature, gas pressure and relative humidity. In particular, the electrical conductivity of the sample produced with molybdenum showed to be much sensitive to changes in gas pressure and relative humidity, being characterised by fast and reversible responses. Copyright Springer-Verlag Berlin/Heidelberg 2003
Year of publication: |
2003
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Authors: | Bruzzi, M. ; Piseri, P. ; Miglio, S. ; Bongiorno, G. ; Barborini, E. ; Ducati, C. ; Robertson, J. ; Milani, P. |
Published in: |
The European Physical Journal B - Condensed Matter and Complex Systems. - Springer. - Vol. 36.2003, 1, p. 3-13
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Publisher: |
Springer |
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