Improving the Interface Bonding of Cnt/Cu Composites Using Cpd Bridges

CNT (carbon nanotube)-CPD (carbonized polymer dots), a hybrid reinforcement, was prepared and employed to reinforce the copper matrix via a powder metallurgy strategy. The CPD-CNT/Cu composite exhibits excellent strength-ductility balance, the yield strength and tensile strength of the composites reach 195 MPa and 306 MPa, which are ~109.5% and ~43.5% higher than those of pure copper (93 MPa and 213 MPa), respectively; the elongation is (29%) as high as that of the copper matrix (28%). More importantly, the electrical conductivity of the CNT-CPD/Cu composite (88.3% IACS) is much higher than that of the CNT/Cu counterpart. The strengthening mechanism of the synergistic action of the CPD and CNT is investigated and discussed in detail. Our research provides important strategies and directions for the improvement and research of copper-based composite materials