Intelligent process design system for the transfer moulding of electronic packages
| Year of publication: |
2004
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|---|---|
| Authors: | Tong, K.W. ; Kwong, C.K. ; Yu, K.M. |
| Published in: |
International journal of production research : American Institute of Industrial Engineers ; Society of Manufacturing Engineers. - London : Taylor & Francis, ISSN 0020-7543, ZDB-ID 1604776. - Vol. 42.2004, 10, p. 1911-1932
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