Interfaces, modularity and ecosystem emergence : how DARPA modularized the semiconductor ecosystem
| Year of publication: |
2023
|
|---|---|
| Authors: | Kuan, Jennifer ; West, Joel |
| Published in: |
Research policy : policy, management and economic studies of science, technology and innovation. - Amsterdam [u.a.] : Elsevier, ISSN 0048-7333, ZDB-ID 121149-3. - Vol. 52.2023, 8, p. 1-14
|
| Subject: | Modularity | R&D policy | Open standards | Innovation ecosystems | Vertical disintegration | Fabless semiconductors | Modularisierung | Halbleiterindustrie | Semiconductor industry | Innovation | Halbleiter | Semiconductor | Innovationssystem | Innovation system | Vertikale Integration | Vertical integration | Welt | World | Innovationsmanagement | Innovation management | Standardisierung | Standardization | Technologiepolitik | Technology policy |
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