International R&D Funding and Patent Collateral in an R&D-Growth Model

This paper develops an R&D-based growth model featuring international R&D funding and patent collateral. It then uses the model to examine how the international borrowing interest rate and the fraction of patent collateral will affect innovations and economic growth.

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Year of publication:	2016-11-03
Authors:	Huang, We-Chi ; Chen, Ping-ho ; Lai, Ching-Chong

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Type of publication:	Book / Working Paper
Language:	English
Notes:	Huang, We-Chi and Chen, Ping-ho and Lai, Ching-Chong (2016): International R&D Funding and Patent Collateral in an R&D-Growth Model.
Classification:	E44 - Financial Markets and the Macroeconomy ; O31 - Innovation and Invention: Processes and Incentives ; O40 - Economic Growth and Aggregate Productivity. General
Source:	BASE

Persistent link: https://www.econbiz.de/10015253751