SURFACE MODIFICATION OF PLASMA TREATMENT ON SiO2 LAYER WITH UNDERFILL

The plasma treatment on SiO2 substrate surfaces increased the oxygen-containing functional groups or the polar component of the surface free energy and, the wetting characteristics of the underfills/SiO2. The plasma treatment condition which gave the smallest contact angle between the underfills and SiO2 was an operating time of 60 sec under O2 gas atmosphere and a power of 200 W.

MoreLess

Year of publication:	2007
Authors:	NOH, BO-IN ; JUNG, SEUNG-BOO
Published in:	Surface Review and Letters (SRL). - World Scientific Publishing Co. Pte. Ltd., ISSN 1793-6667. - Vol. 14.2007, 04, p. 849-852
Publisher:	World Scientific Publishing Co. Pte. Ltd.
Subject:	Plasma treatment \| silicon oxide \| surface modification \| underfill

More details

Extent:	application/pdf text/html
Type of publication:	Article
Source:	RePEc - Research Papers in Economics

Persistent link: https://www.econbiz.de/10005050555