TQM practices and affective commitment: a case of Malaysian semiconductor packaging organizations
| Year of publication: | 
                              2006-07-15         | 
|---|---|
| Authors: | Boon, Ooi Keng ; Safa, Mohammad Samaun ; Arumugam, Veeri | 
| Institutions: | Volkswirtschaftliche Fakultät, Ludwig-Maximilians-Universität München | 
| Subject: | Total quality management | affective commitment | Malaysia | semiconductor industry | 
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