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~isPartOf:"Economics letters"
~isPartOf:"European journal of innovation management"
~person:"Ho, Chun-Yu"
~subject:"Innovation"
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International knowledge spillover through trade : a time-varying spatial panel data approach
Ho, Chun-Yu
;
Wang, Wei
;
Yu, Jihai
- In:
Economics letters
162
(
2018
),
pp. 30-33
Persistent link: https://www.econbiz.de/10011939744
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