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Search: "Dilhaire, S."
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Claeys, W.
6
Dilhaire, S.
6
Quintard, V.
5
Lewis, D.
4
Danto, Y.
3
Phan, T.
2
Aucouturier, J.L.
1
Dom, J.P.
1
Grauby, S.
1
Jorez, S.
1
Parmentier, B.
1
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Quality and reliability engineering international
5
IEEE transactions on reliability : R ; IEEE T R
1
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OLC EcoSci
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1
Component Reliability and Testing - Strain Energy Imaging of a Power MOS Transistor Using Speckle Interferometry
Dilhaire, S.
;
Grauby, S.
;
Jorez, S.
;
Claeys, W.
- In:
IEEE transactions on reliability : R ; IEEE T R
53
(
2004
)
2
,
pp. 293
Persistent link: https://www.econbiz.de/10006609584
Saved in:
2
Laser Probe Measurements of Quality Evolution of Solder Joints during Thermal Cycling Ageing Tests
Quintard, V.
;
Parmentier, B.
;
Phan, T.
;
Lewis, D.
; …
- In:
Quality and reliability engineering international
12
(
1996
)
6
,
pp. 447-452
Persistent link: https://www.econbiz.de/10006402325
Saved in:
3
Optical Ammeter for Integrated Circuit Characterization and Failure Analysis
Claeys, W.
;
Dilhaire, S.
;
Lewis, D.
;
Quintard, V.
;
Phan, T.
- In:
Quality and reliability engineering international
11
(
1995
)
4
,
pp. 247-252
Persistent link: https://www.econbiz.de/10006404884
Saved in:
4
Early Detection of Ageing in Solder Joints through Laser Probe Thermal Analysis of the Peltier Effect
Claeys, W.
;
Quintard, V.
;
Dilhaire, S.
;
Lewis, D.
;
Danto, Y.
- In:
Quality and reliability engineering international
10
(
1994
)
4
,
pp. 289-296
Persistent link: https://www.econbiz.de/10006408725
Saved in:
5
Testing of the Quality of Solder Joints through the Analysis of their Thermal Behaviour with an Interferometric Laser Probe
Claeys, W.
;
Quintard, V.
;
Dilhaire, S.
;
Lewis, D.
;
Danto, Y.
- In:
Quality and reliability engineering international
10
(
1994
)
3
,
pp. 237-242
Persistent link: https://www.econbiz.de/10006408735
Saved in:
6
Thermoreflectance Optical Test Probe for the Measurement of Current-induced Temperature Changes in Microelectronic Components
Claeys, W.
;
Dilhaire, S.
;
Quintard, V.
;
Dom, J.P.
;
Danto, Y.
- In:
Quality and reliability engineering international
9
(
1993
)
4
,
pp. 303-308
Persistent link: https://www.econbiz.de/10006413427
Saved in:
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