GE, JIE; LIU, XUAN; YANG, YI; SONG, YIXU; REN, TIANLING - In: Surface Review and Letters (SRL) 21 (2014) 03, pp. 1450038-1
As the key feature size keeps shrinking down, inductively coupled plasma (ICP) has been widely used for etching. In this study, a commercial ICP etcher filled with Cl2/Ar mixture was simulated. The simulation was based on a commercial software CFD-ACE+, which is a multi-module solver. For the...
