Ping Yi, Tan; Jeng Feng, Chin; Prakash, Joshua; Wei … - In: International Journal of Lean Six Sigma 3 (2012) 3, pp. 206-230
Purpose – In electronics assembly, the losses of electronic components throughout the surface‐mounting process … case. The evidence may be anecdotal and idiosyncratic to the electronics assembly industry. The final solutions which … – Component loss is a common problem faced by electronics assembly industries. In this paper, the nature of the problem and the …