TANG, Y.; FUH, J. Y. H.; LOH, H. T.; WONG, Y. S.; LIM, Y. K. - In: Surface Review and Letters (SRL) 15 (2008) 01, pp. 153-159
cut quality. It has been found that oxygen is the most suitable assist gas for laser dicing and that the highest gas … passes are also studied. Under optimized parameters, the cut quality of Si wafer using laser dicing is found to be comparable …