Fu, Z.; Huang, C.X.; Liu, R.Q.; Zhao, Y.Z.; Cao, Q.X. - In: Industrial Robot: An International Journal 35 (2008) 6, pp. 536-540
Purpose – The aim of this paper is to provide a new wafer prealigning robot for the photo‐etching facility during the manufacturing of IC products. Design/methodology/approach – The shape center is measured by a reflection‐style laser sensor in the wafer's radial direction, and the...