The microelectronic devices are formed by a substrate that supports the functional thin film material. The thermal, electrical, and mechanical properties of the system depend strongly on the interfacial properties between a film and a substrate. The interfacial nature in a film/substrate system...

We present an improved dynamical thermal model and the corresponding experimental efforts to determine thermal profiles of thin metallic films deposited on thick substrates (bimaterial system) as are usually used in microelectronics. A dynamical thermal model to characterize the Joule heating of...

The electrical resistivity (ρ), resistive thermal coefficient (αr), thermal expansion coefficient (αt) and stress (σ) of Al and Au thin films deposited by thermal evaporation were measured while films were heated by Joule effect. Electrical resistivity measured by the four-probe technique...