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Quality and reliability engineering international
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A Case Study on Process Monitoring for Surface Features
Taam, W.
- In:
Quality and reliability engineering international
14
(
1998
)
4
,
pp. 219-226
Persistent link: https://www.econbiz.de/10006392308
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Process Monitoring in Integrated Circuit Fabrication Using Both Yield and Spatial Statistics
Collica, R.S.
;
Ramirez, J.G.
;
Taam, W.
- In:
Quality and reliability engineering international
12
(
1996
)
3
,
pp. 195-202
Persistent link: https://www.econbiz.de/10006397550
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