Electromigration in AlCu Interconnections with W-plug Contacts
Year of publication: |
1993
|
---|---|
Authors: | Ferlazzo, L. ; Reimbold, G. ; Gonchond, J.P. ; Heitzmann, M. ; Demolliens, O. ; Lormand, G. |
Published in: |
Quality and reliability engineering international. - Chichester [u.a.] : Wiley, ISSN 0748-8017, ZDB-ID 506412. - Vol. 9.1993, 4, p. 299-302
|
Saved in:
Saved in favorites
Similar items by person
-
Study of the Influence of Thermal Effects on the Electromigration Tests
Abdeslam, S., (1995)
-
Observation of Submicronic Contacts and Vias by Scanning Ion and Electron Microscopy
Pantel, R., (1994)
-
Electromigration of Interconnects of a TiN-Cu-TiN-Ti Structure
Braud, F., (1996)
- More ...