Automated bonding position inspection on multi-layered wire IC using machine vision
| Year of publication: |
2010
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|---|---|
| Authors: | Perng, Der-Baau ; Lee, Shu-Ming ; Chou, Cheng-Chuan |
| Published in: |
International journal of production research : American Institute of Industrial Engineers ; Society of Manufacturing Engineers. - London : Taylor & Francis, ISSN 0020-7543, ZDB-ID 1604776. - Vol. 48.2010, 23, p. 6977-7002
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