Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products
Year of publication: |
2011
|
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Authors: | Ilgin, Mehmet ; Gupta, Surendra M. ; Nakashima, Kenichi |
Published in: |
Journal of remanufacturing. - Heidelberg : Springer, ISSN 2210-4690, ZDB-ID 2636480-3. - Vol. 1.2011, p. 1-14
|
Subject: | disassembly line | experimental design | sensor embedded products | cost-benefit analysis | discrete event simulation | Produkt-Recycling | Product recovery | Produktgestaltung | Product design | Messtechnik | Measurement technology | Kosten-Nutzen-Analyse | Cost-benefit analysis |
Extent: | graph. Darst. |
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Type of publication: | Article |
Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
Language: | English |
Notes: | Systemvoraussetzung: Acrobat Reader |
Other identifiers: | 10.1186/2210-4690-1-7 [DOI] hdl:10419/108885 [Handle] |
Source: | ECONIS - Online Catalogue of the ZBW |
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