Coping with disassembly yield uncertainty in remanufacturing using sensor embedded products
Year of publication: |
2011
|
---|---|
Authors: | Ilgin, Mehmet ; Gupta, Surendra M. ; Nakashima, Kenichi |
Published in: |
Journal of Remanufacturing. - Heidelberg : Springer, ISSN 2210-4690. - Vol. 1.2011, p. 1-14
|
Publisher: |
Heidelberg : Springer |
Subject: | Produkt-Recycling | Produktgestaltung | Messtechnik | Kosten-Nutzen-Analyse | disassembly line | experimental design | sensor embedded products | cost-benefit analysis | discrete event simulation |
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