EXPERIMENTAL OBSERVATIONS OF ORDERLY STRUCTURES IN COPPER FILMS DEPOSITED ON LIQUID SUBSTRATES

In this paper, an optical microscopy study of orderly structures, namely bands, which are observed in a nearly free sustained copper (Cu) film system, is presented. The band is composed of a large number of parallel key-formed domains with different width w but nearly uniform length L. This study shows that the morphologies of the Cu films are very susceptible to the deposition rate, i.e. with the increase in the deposition rate f, the bands with rectangular domains first become irregular gradually and then disappear completely. The experiment indicates that the growth mechanism of the orderly patterns can be explained in terms of the relaxation of the internal stress in the films, which is related to the characteristic boundary condition of the films on the liquid substrates and the nearly zero adhesion of the solid–liquid interface.