IoT platform stickiness and positioning in the value chain : considerations for a sub-supplier

Anna Marie Dyhr Ulrich and Svend Hollensen, Pernille Eskerod

Year of publication:	2023
Authors:	Ulrich, Anna Marie Dyhr ; Hollensen, Svend ; Eskerod, Pernille
Published in:	International journal of value chain management : IJVCM. - Olney, Bucks. : Inderscience Enterprises, ISSN 1741-5365, ZDB-ID 2232972-9. - Vol. 14.2023, 3, p. 309-324
Subject:	business model \| digital servitisation \| downstream \| internet of things \| IoT \| platform stickiness \| sub-supplier \| trade-off decision \| value chain \| Internet der Dinge \| Internet of things \| Betriebliche Wertschöpfung \| Value creation \| Geschäftsmodell \| Business model \| Digitale Plattform \| Digital platform \| Lieferkette \| Supply chain \| Electronic Commerce \| E-commerce

Online Resource

Check full text access |

More access options

doi.org

Check Google Scholar

In libraries world-wide (WorldCat)

In German libraries (KVK)

Which error do you want to report?

Report: URL of this record is broken

Please note: Sometimes more than one URL is available for a resource. Please click on "More Options" to display these URLs

Report: Addition of an URL to that resource

Please note: Sometimes more than one URL is available for a resource. Please click on "More Options" to display these URLs

Report: The language(s) of that resource is/are…

Please note: Required language not in the list? Please use comment field

Report: Addition of an identifier to that resource

Report: report typo

Report: Add statement

Report: Add keywords

Please use the commentary box to describe other errors

Would you like to receive a feedback?

Commentary

Please type the code from the image

For general questions please use this address.

Persistent link: https://www.econbiz.de/10014426526

A service of the