The paper presents a method of centering flat objects. An objects position can be computed in a fraction of a second with great accuracy. The method makes the construction of automatic center systems easier. Application of the method to the automatic assembly of integrated circuits can decrease the production costs and make the LSI circuits design and construction process more versatile. The method makes the automatic centering of masks and semiconductor wafers possible and may prove helpful in the application of new technologies and types of integrated circuits. The method also solves the problem of centering semiconductor wafers when using electron beam scanning systems.