Modelling and analysis of waviness reduction in soft-pad grinding of wire-sawn silicon wafers by support vector regression
Year of publication: |
2006
|
---|---|
Authors: | Shen, Judong ; Pei, Z.J. ; Lee, E.S. ; Fisher, G.R. |
Published in: |
International journal of production research : American Institute of Industrial Engineers ; Society of Manufacturing Engineers. - London : Taylor & Francis, ISSN 0020-7543, ZDB-ID 1604776. - Vol. 44.2006, 13, p. 2605-2624
|
Saved in:
Saved in favorites
Similar items by person
-
Jiao, Y., (2005)
-
Zhang, Qi, (2015)
-
Zhang, Qi, (2013)
- More ...