Molding compound trends in a denser packaging world: Qualification tests and reliability concerns
| Year of publication: |
1993
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| Authors: | Nguyen, L. ; Lo, R. ; Chen, A. ; Belani, J. |
| Published in: |
IEEE transactions on reliability : R ; IEEE T R. - New York, NY, ISSN 0018-9529, ZDB-ID 2416372. - Vol. 42.1993, 4, p. 518-535
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