Numerical simulation approach on stress and strain for chip scale package under thermal cycling
Yang Ping and Wei Li
| Year of publication: |
2009
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|---|---|
| Authors: | Ping, Yang ; Li, Wei |
| Published in: |
International journal of manufacturing technology and management. - Milton Keynes [u.a.] : Inderscience Enterprises, ISSN 1368-2148, ZDB-ID 20374021. - Vol. 18.2009, 3, p. 300-307
|
| Extent: | Ill., graph. Darst. |
|---|---|
| Type of publication: | Article |
| Language: | English |
| Source: |
Persistent link: https://www.econbiz.de/10009873171