PLATING OF COPPER LAYERS ON POLYIMIDES USING ELECTROLESS PLATING BY SURFACE MODIFICATION

This work describes electroless deposition of copper layers onto a polyimide (PI) film. The film was modified by etching with 1.0 M KOH solution treatment, and an activated Ag thin film was developed on this surface using 0.1 M AgNO3. The Cu layers were coated on the activated surface of polyimide films by electroless plating method. The thickness and surface morphology of Cu layers on the PI films were characterized with atomic force microscopy. The surface properties of PI film were identified with contact angle measurements.