The Integrated Circuit Packaging Scheduling Problem (ICPSP): A Case Study
Year of publication: |
2005
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Authors: | Pearn, W.L. ; Chung, S.H. ; Yang, M.H. ; Chen, C.Y. |
Published in: |
International journal of industrial engineering : applications and practice. - Cincinnati, ISSN 1072-4761, ZDB-ID 13637046. - Vol. 12.2005, 3, p. 296-307
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