Thermal management of software changes in product lifecycle of consumer electronics
Year of publication: |
2015
|
---|---|
Authors: | Muraoka, Yoshio ; Seki, Kenichi ; Nishimura, Hidekazu |
Published in: |
International journal of product lifecycle management : IJPLM. - Olney, Bucks. : Inderscience Enterprises, ISSN 1743-5110, ZDB-ID 2193378-9. - Vol. 8.2015, 4, p. 348-362
|
Subject: | product lifecycle management | thermal design | SysML | software change | electronic products | embedded system | system level | simulation | collaborative design | low-temperature burn injury | Produktlebenszyklus | Product life cycle | Software | Produktgestaltung | Product design | Elektronikindustrie | Electronics industry | Innovationsmanagement | Innovation management | Produktmanagement | Product management | Elektronisches Produkt | Electronic product | Produktentwicklung | New product development | Simulation | Softwareentwicklung | Software development |
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