Thermal management of software changes in product lifecycle of consumer electronics
Yoshio Muraoka and Kenichi Seki (SDM Research Institute, Keio University, Yokohama, Kanagawa, Japan), Hidekazu Nishimura (Graduate School of System Design and Management, Keio University, Yokohama, Kanagawa, Japan)
| Year of publication: |
2015
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|---|---|
| Authors: | Muraoka, Yoshio ; Seki, Kenichi ; Nishimura, Hidekazu |
| Published in: |
International journal of product lifecycle management : IJPLM. - Olney, Bucks. : Inderscience Enterprises, ISSN 1743-5110, ZDB-ID 2193378-9. - Vol. 8.2015, 4, p. 348-362
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| Subject: | product lifecycle management | thermal design | SysML | software change | electronic products | embedded system | system level | simulation | collaborative design | low-temperature burn injury | Produktlebenszyklus | Product life cycle | Software | Produktgestaltung | Product design | Elektronikindustrie | Electronics industry | Innovationsmanagement | Innovation management | Produktmanagement | Product management | Elektronisches Produkt | Electronic product | Produktentwicklung | New product development | Simulation | Softwareentwicklung | Software development |
| Type of publication: | Article |
|---|---|
| Type of publication (narrower categories): | Aufsatz in Zeitschrift ; Article in journal |
| Language: | English |
| Source: | ECONIS - Online Catalogue of the ZBW |
Persistent link: https://www.econbiz.de/10011546875