Three-dimensional transient cooling simulations of a portable electronic device using PCM (phase change materials) in multi-fin heat sink

Transient three-dimensional heat transfer numerical simulations were conducted to investigate a hybrid PCM (phase change materials) based multi-fin heat sink. Numerical computation was conducted with different amounts of fins (0 fin, 3 fins and 6 fins), various heating power level (2 W, 3 W and 4 W), different orientation tests (vertical/horizontal/slanted), and charge and discharge modes. Calculating time step (0.03 s, 0.05 s, and 0.07 s) size was discussed for transient accuracy as well. The theoretical model developed is validated by comparing numerical predictions with the available experimental data in the literature. The results showed that the transient surface temperatures are predicted with a maximum discrepancy within 10.2%. The operation temperature can be controlled well by the attendance of phase change material and the longer melting time can be conducted by using a multi-fin hybrid heat sink respectively.