GUO, R. H.; JIANG, S. Q.; YUEN, C. W. M.; NG, M. C. F. - In: Surface Review and Letters (SRL) 15 (2008) 05, pp. 587-593
The effects of plating temperature on the plating rate, P content, surface morphology, and electrical resistance of the electroless Ni–P deposits were studied. The results showed that the deposition rate of the Ni–P deposit and P content of the Ni–P layer increased with the rise of...