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Automated bonding position inspection on multi-layered wire IC using machine vision
Perng, Der-baau
;
Lee, Shu-ming
;
Chou, Cheng-chuan
- In:
International journal of production research
48
(
2010
)
23/24
,
pp. 6977-7001
Persistent link: https://www.econbiz.de/10008758935
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