Narrow search
Showing 1 - 9 of 9
Cover Image
Suppliers capability and price analysis chart
Chen, K.L.; Chen, K.S.; Li, R.K. - In: International Journal of Production Economics 98 (2005) 3, pp. 315-327
Persistent link: https://www.econbiz.de/10005312053
Cover Image
Suppliers capability and price analysis chart
Chen, K.L.; Chen, K.S.; Li, R.K. - In: International journal of production economics 98 (2005) 3, pp. 315-327
Persistent link: https://www.econbiz.de/10006233780
Cover Image
Process capability analysis for an entire product
Chen, K.S.; Huang, M.L.; Li, R.K. - In: International journal of production research : American … 39 (2001) 17, pp. 4077
Persistent link: https://www.econbiz.de/10006130590
Cover Image
Solution strategies for multi-stage wafer probing scheduling problem with reentry
Pearn, W.L.; Chung, S.H.; Yang, M.H.; Shiao, K.P. - In: Journal of the Operational Research Society : OR 59 (2008) 5, pp. 637-651
Persistent link: https://www.econbiz.de/10007993337
Cover Image
A case study on the multistage IC final testing scheduling problem with reentry
Pearn, W.L.; Chung, S.H.; Chen, A.Y.; Yang, M.H. - In: International journal of production economics 88 (2004) 3, pp. 257-268
Persistent link: https://www.econbiz.de/10006248339
Cover Image
A case study on the wafer probing scheduling problem
Pearn, W.L.; Chung, S.H.; Yang, M.H. - In: Production planning & control : PPC 13 (2002) 1, pp. 66-75
Persistent link: https://www.econbiz.de/10007169019
Cover Image
Minimizing the total machine workload for the wafer probing scheduling problem
Pearn, W.L.; Chung, S.H.; Yang, M.H. - In: IIE transactions / Institute of Industrial Engineers, … 34 (2002) 2, pp. 211-220
Persistent link: https://www.econbiz.de/10006177434
Cover Image
Algorithms for the wafer probing scheduling problem with sequence-dependent set-up time and due date restrictions
Pearn, W.L.; Chung, S.H.; Yang, M.H.; Chen, Y.H. - In: Journal of the Operational Research Society : OR 55 (2004) 11, pp. 1194-1207
Persistent link: https://www.econbiz.de/10006020428
Cover Image
The Integrated Circuit Packaging Scheduling Problem (ICPSP): A Case Study
Pearn, W.L.; Chung, S.H.; Yang, M.H.; Chen, C.Y. - In: International journal of industrial engineering : … 12 (2005) 3, pp. 296-307
Persistent link: https://www.econbiz.de/10005919703